COREWORKS

Classe 9 — Tecnologia

Electronic and electrical components, namely, frequency control devices, microelectromechanical systems, crystal resonators, oscillators and modules, electrical and radio frequency signal filters, surface acoustic wave filter, multiplexers, duplexers, ceramics filters, baluns, antennas, antenna modules; capacitors, electrical and electronic inductors, electric resistors; electronic and electrical circuit protection devices; supercapacitors for energy storage; ultracapacitors for energy storage; batteries; semiconductors; diodes; transistors; voltage regulators; analog electronic signal turners; radio signal tuners; amplifiers; transmitters of electronic signals; receivers of electronic signals; integrated circuits; application-specific integrated circuits; microcontrollers; logic circuits; logic integrated circuits; mixed signal integrated circuits; power management integrated circuits; electronic servo motor controllers; electronic controls for motors; electric sensors; hall sensors; light emitting diodes; display devices; gyroscope sensors; optical sensors; opto-isolaters; optocouplers; memory boards; memory cards; memory modules; electrical and electronic connectors; wire connectors; optical fiber connectors; connectors for electronic circuits; board to board connectors, wire to wire connectors, wire to board connectors; terminals; battery terminals; battery clips, battery contacts, battery springs; pin headers; electrical sockets; electric sockets; semiconductor wafers; wafers for integrated circuits; electric switch housings; electrical connector housings; housings for printed circuit boards; card edge connectors; FFC and FPC connectors; PCI-E connectors, industrial connectors, terminal blocks, heavy-duty connectors, high power connectors, high speed connectors, SFP/QSFP/OSFP connectors, I/O connectors, USB connectors, D-Sub connectors, DP connectors, ethernet connectors, RJ45 Connectors, DC Jack, audio jack, HDMI connectors, DVI connectors, Pogo Pins, IDC connectors, RF connectors, Mini RF connectors, Mini RF Switch, SMA connectors, TNC connectors, Rectangular connectors, Circular connectors, automotive connectors, Fakra connectors, mini Fakra connectors, HSD connectors, Backplane connectors; electronic and electrical wires, cables and cables assemblies; cable harnesses; power cables; power whips; optical cables; USB cables; High speed direct attached cables (OSFP, QSFP, SFP, Ethernet, PCI-E, RJ45); EV charging guns, EV charging cables, EV charging inlet, Copper Busbars, Aluminum busbars, Flexible busbars, multilayer busbars, lamination busbars, Rod Busbars, Integrated Busbars, Solid Busbars, automotive busbars, OCP busbars, ORV2 busbars, ORV3 busbars, power elements, printed circuits boards, flexible printed circuits, flexible flat cables, high speed active copper cables and active electrical cables (OSFP, QSFP, SFP), Internal High-speed cable (Mini SAS, SLIM SAS, MCIO, Multi-Track, etc.), I/O cable (TYPE C cable, MFI cable, DP cable), high definition multimedia interface cables; CCS, PV cables; Optical signal Interconnect devices, namely, Optical fiber cable (MPO, LC, FC, SC, etc.); active optional cables; AOC (OSFP, QSFP, SFP, etc.), transceivers (OSFP, QSFP, SFP, etc.); Optical modular; electric buzzers; audio speakers; microphones; Piezo devices; electrical transducers; piezo transducer; electro-magnetic transducers; ultrasonic sensors; powder level sensors; air quality sensors; MEMS ToF sensors; pressure sensors; Nebulizer modules; E (Electronic)-Nose sensor; magnetic field sensors; accelerometer sensors; Bio sensors; photoplethysmography sensors; temperature sensors; cooling fans for analog and digital electrical and electronic equipment; heat sinks for use in electronic components; liquid cooling system; Quick Disconnect couplings; universal quick disconnect couplings; UQD connectors; UQDB connectors; universal blind-mate quick (BMQC) connectors; tube (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); liquid leakage detection wires; liquid cooling distribution manifolds, cold plates and hoses and pumps; antennas; external antennas, cabled external antennas, Dipole antennas, patch antennas, Dome antennas, MIMO antennas, Stub antennas, Automotive antennas; Internal antennas, PCB antennas, FPC antennas, Chip antenna, Helix Antennas, metal antennas, NFC Antennas, Precision Location Antennas, GPS Antennas, Beidou Antennas, GNSS Antennas; Antenna Array, Antenna Filter Unit; levelers (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations).;